RADIATION HARDENED MICROELECTRONICS ACQUISITION ENGINEER

You will serve as a

RADIATION HARDENED MICROELECTRONICS ACQUISITION ENGINEER

in the FIRE CONTROL & GUIDANCE BRANCH (SP23) of

STRATEGIC SYSTEMS

PROGRAMS.You will maintain process control, quality, throughput, and on-time delivery for Tier 2 suppliers manufacturing Circuit Card Assemblies (CCAs) and electrical sub-components.You will monitor production line health, yields, and supplier process capabilities using Lean Six Sigma and statistical process controls.You will define and execute procurement controls for strategic sub-components, with an emphasis on radiation-hardened electronic components.You will coordinate with design authorities to manage material obsolescence and execute life-of-type (LOT) buys or alternative sourcing strategies to safeguard the industrial base.You will establish, review, and verify testing protocols, technical specifications, and disposition plans for Lot Acceptance Testing (LAT).You will ensure that incoming microelectronics lots meet strict strategic weapon system reliability and performance criteria prior to integration.You will coordinate and lead complex piece-part and CCA-level failure analyses to isolate root causes of workmanship or material failures.You will serve as the primary program liaison to NSWC Crane Division to leverage their laboratory capabilities for physical failure analysis, destructive physical analysis (DPA), and material evaluation.You will formulate, submit, and defend Tier 2 supply chain budgetrequirements (PPBE/POM/FYDP inputs).You will manage contracts, review technical proposals for component-level buys, monitor supplier cost/schedule performance metrics, and implement corrective mitigation plans for budget or schedule deviations.